Semiconductor device and semiconductor device unit having ball-grid-array type package structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 10, 1998
Grant Date -
N/A
app pub date -
Feb 24, 1997
filing date -
Jun 13, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device or a semiconductor device unit having a ball-grid-array type package structure, comprises a semiconductor element, a base having a mounting surface and a connection surface opposite to each other, the semiconductor element being mounted on the mounting surface, a plurality of balls which function as external connection terminals being provided on the connection surface, a sealing resin sealing the semiconductor element, and an electrically conductive electrode member, a first end of the electrode member being electrically connected to the semiconductor element on the mounting surface of the base, a second end of the electrode member being electrically connective to an outer terminal. An electrically conductive pin which can pass through the sealing resin can be used as the electrode member. Even after the semiconductor device is mounted on a circuit board, a test on the semiconductor element can be conducted. Also, a reliability of electric appliances and a heat release efficiency can be improved.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully