Injection molding method for board for IC card
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United States of America Patent
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-
Mar 10, 1998
Grant Date -
N/A
app pub date -
Jul 21, 1995
filing date -
Jul 21, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plate for an IC card having recesses for mounting components is formed by injection molding of plastics. First, a mold for forming recesses for mounting components is formed to have a slide core. After molten resin is filled in a cavity, the slide core is forced to penetrate into the cavity. Thus, the molten resin is removed by the slide core so as to form the recesses and walls. Because the resin has been filled beforehand, even if the wall is thin, the filling process is carried out normally, and the walls can be formed without increasing an injection pressure.
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