Microcircuit via interconnect
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 10, 1998
Issued Date -
N/A
app pub date -
Nov 5, 1996
filing date -
Feb 6, 1995
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present upon the substrate prevents degradation of the thin conductive film. Subsequent processing of the gold paste assures the integrity and reliability thereof. Thus, the gold paste provides enhanced conductivity and improved reliability, as compared to contemporary thin-film vias.
First Claim
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International Classification(s)
- 1996 Application Filing Year
- H01L Class
- 6175 Applications Filed
- 3867 Patents Issued To-Date
- 62.63 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 20 Citation Count
- H01L Class
- 41.28 % this patent is cited more than
- 27 Age