Adhesive composition and process for curing the same

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United States of America Patent

PATENT NO 5717009
SERIAL NO

08676300

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An adhesive composition which comprises: (A) 100 parts by weight of a polyorganosiloxane represented by the formula (I): ##STR1## (wherein R.sup.1 s may be the same or different from each other and each represent a monovalent hydrocarbon group or a halogen-substituted hydrocarbon group; and n is a positive integer); (B) 0.5 to 10 parts by weight of a tetraalkoxysilane represented by the following formula: R.sup.2.sub.a Si(OR.sup.3).sub.4-a (II) (wherein R.sup.2 represents an alkyl group having 1 to 3 carbon atoms, a phenyl group or a vinyl group; R.sup.3 represents an alkyl group having 1 to 4 carbon atoms or an alkoxy-substituted alkyl group having 3 to 6 carbon atoms; and a is 0 or 1), or a partially hydrolyzed condensate thereof; and (C) 0.1 to 15 parts by weight of a trialkoxysilane represented by the formula (III): R.sup.4 (R.sup.5).sub.b Si(OR.sup.6).sub.3-b (III) (wherein R.sup.4 represents a substituted or unsubstituted aminoalkyl group; R.sup.5 represents an alkyl group having 1 to 3 carbon atoms, a phenyl group or a vinyl group; R.sup.6 represents an alkyl group having 1 to 3 carbon atoms; and b is 0 or 1), wherein the molar ratio of total alkoxy groups in Components (B) and (C) to hydroxyl groups in Component (A) is (--OR.sup.2 +--OR.sup.6)/--OH>8, and a process for curing the same.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA SILICONE CO LTDTOKYO 106

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Fumihiko Tokyo, JP 24 232
Matsushita, Shigeki Tokyo, JP 7 56

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