Aqueous coating composition based on low-solvent modified epoxy resin dispersions
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United States of America Patent
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Jan 13, 1998
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N/A
app pub date -
Sep 25, 1996
filing date -
Sep 29, 1995
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Abstract
Aqueous low-solvent coating compositions comprising a modified epoxy resin dispersion comprising an epoxy resin which is prepared by condensation of one or more epoxide compounds having at least two epoxide groups per molecule with an aromatic polyol; a dispersant comprising a condensation product of an aliphatic polyol and an epoxide compound having at least two epoxide groups per molecule; a diluent consisting of ethylenically unsaturated otherwise inert or, if desired, functional monomers capable of free-radical polymerization or copolymerization, and water, and also an aqueous curing agent for the modified epoxy resin (I), which is suitable for curing at room temperature or at elevated temperatures (forced drying), components (I) and (II) being employed in proportions by mass such that the ratio of the number of epoxide groups which are capable of reaction to the number of amine hydrogen atoms is between 1:0.75 and 1:2. The coating compositions can be employed to produce matt coatings and in adhesives.
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