Liquid metal pump and apparatus for use in cleaning and recycling solder
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United States of America Patent
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Jan 13, 1998
Grant Date -
N/A
app pub date -
Feb 5, 1996
filing date -
Feb 5, 1996
priority date (Note) -
Expired
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Abstract
A liquid metal electromagnetic pump 17 operates by passing an electric current through the liquid metal in a direction transverse to an applied magnetic field and the longitudinal axis of the liquid metal flow pipe. The direction of the pump is reversible by reversing the electric current. It is used to transfer batches of contaminated solder from a reservoir 12 in a hot air solder leveller 11 to a treatment tank (TA or TB). Contamination of the solder is removed by a cleaning process and the liquid solder returned to the reservoir 12 after heating to the required process temperature.
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