Non-Aminic photoresist adhesion promoters for microelectronic applications
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United States of America Patent
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Dec 30, 1997
Issued Date -
N/A
app pub date -
Nov 27, 1995
filing date -
Nov 22, 1994
priority date (Note) -
Expired
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Abstract
A method for providing an inorganic substrate having improved adherence for polymeric films is disclosed. The method entails reacting at least one organosilane compound having at least one alkylsilyl moiety therein and at least one hydrolyzable group capable of reacting with the substrate to silylate the substrate. Hydrolyzable by-products from the reaction, if any, have a pH less than or equal to about 7.
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