Device for moving an object by means of thermal change in shape or volume
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United States of America Patent
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Dec 30, 1997
Issued Date -
N/A
app pub date -
May 7, 1996
filing date -
Nov 8, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention provides a device for moving an object by means of thermal change in shape or volume, such that the object is moved when a predetermined process temperature has been reached. Preferably the device can be used in a soldering system on a printed circuit board. The advantage of the invention lies in a temperature-controlled movement of the object with a high-level precision that, for example, ensures a very sparing unsoldering.
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