Device having a reduced parasitic thermal load for terminating thermal conduit
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United States of America Patent
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Dec 16, 1997
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N/A
app pub date -
Sep 20, 1995
filing date -
Sep 20, 1995
priority date (Note) -
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Abstract
A device for receiving thermal conduit comprising a thermally conductive material for coupling between an end of a conducting element of the thermal conduit and an end of an outer shell of the thermal conduit. The thermally conductive material is arranged to physically define a best thermal path from the end of the conducting element to the end of the outer shell such that substantially all thermal energy dissipated from the conducting element to the outer shell flows along the best thermal path. The length of the best thermal path is significantly greater than a nearest distance between the conducting element and the outer shell, and the conductive material is thin and manufactured of a poor thermal conductor such that the total energy dissipated along the best thermal path is reduced.
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