Stencil stamp assembly
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United States of America Patent
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Dec 9, 1997
Issued Date -
N/A
app pub date -
Feb 21, 1997
filing date -
Apr 20, 1994
priority date (Note) -
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Abstract
A stencil stamp assembly having a comparatively small size, high ink holding capacity, excellent stamping durability and is capable of stamping images having a high print quality. The stencil stamp includes a handgrip and a stencil stamp assembly. The stencil stamp assembly includes an ink bearing member covered with a thermal stencil sheet. The thermal stencil sheet has a plurality of pores on holes arranged in a pattern. During a stamping action, ink from the ink bearing member is forced through the pores in the stencil sheet and onto a recording sheet to form a stamped image on the recording sheet. The ink bearing member has at least two layers having different densities. The less dense layer is in contact with the thermal stencil sheet. The least dense layer provides a large ink storage capacity. The more dense layer has a higher ink holding capacity, which reduces the potential for ink leakage. The more dense layer is also more firm, which reduces creasing and distortion of the stencil sheet both during stamping and during formation of the pore pattern in the stencil sheet.
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