Process and soldering paste for soldering on large-area plates of aluminum or aluminum alloys and use of that process
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United States of America Patent
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Nov 25, 1997
Issued Date -
N/A
app pub date -
Jun 17, 1996
filing date -
Nov 19, 1993
priority date (Note) -
Expired
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Abstract
In a process for soldering on large-area plates of aluminum or aluminum alloys on to a workpiece comprising an iron-base alloy, use is made of a soldering paste comprising a flux with about 50% potassium fluoride and about 50% aluminum fluoride, a solder powder with about 80 to 90% aluminum and 20 to 10% silicon and a binder on a polymethacrylate base. In addition the respective proportions of the flux are between 40 and 60% by weight, the solder powder between 60 and 40% by weight and the binder between 0.2 and 2% by weight.
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