Hermetic sealing composition
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United States of America Patent
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Nov 4, 1997
Grant Date -
N/A
app pub date -
Jul 30, 1996
filing date -
Aug 22, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A hermetic sealing composition comprising 100 parts by weight of a basic composition consisting of from 80 to 99.9 wt % of a crystalline low melting glass powder containing lead and boron and from 0.1 to 20 wt % of a low expansion ceramic filler, and from 0.001 to 1.0 part by weight, in total, of at least one of an .alpha.-4PbO.B.sub.2 O.sub.3 crystal powder and a Pb.sub.3 O.sub.4 powder, incorporated to the basic composition, the thermal expansion coefficient of the sealing composition after firing being from 80.times.10.sup.-7 to 105.times.10.sup.-7 /.degree.C. within a range of from room temperature to 300.degree. C.
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