Anti-bridging pads for printed circuit boards and interconnecting substrates

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United States of America Patent

PATENT NO 5679929
SERIAL NO

08508739

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Abstract

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The present invention provides anti-bridging pad(s) for wave soldering of interconnecting substrates. In particular, the present invention provides interconnecting substrates (e.g. printed circuit board) having anti-bridging pad(s) which substantially conform to trailing pad(s), have geometries and/or placements with respect to trailing pad(s) in an array of functional pads which reduce or eliminate solder bridging.

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Patent Owner(s)

Patent OwnerAddress
SOLECTRON CORPORATION847 GIBRALTAR DRIVE MILPITAS CA 95035

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Greenfield, Douglas Wayne Concord, NC 1 12
Yorkovich, Richard Paul Mt. Gilead, NC 1 12

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