Thermally conductive interface for electronic devices

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United States of America Patent

PATENT NO 5679457
SERIAL NO

08617024

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Abstract

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A mechanically conformable thermally conductive interface for use in electrically isolating and thermally connecting printed circuit boards to either beat sinks, metal chasses, or heat spreaders. The interface material utilizes silicone polymers of controlled molecular weight and a surface layer of a pressure sensitive adhesive may be employed. The silicone polymer is filled with a thermally conductive electrically insulative particulate such as alumina and/or boron nitride, with the silicone being prepared as a reaction product of a liquid organosiloxane together with a chain extender such as a hydride terminated polydimethylsiloxane material. A release film such as polyethylene may be utilized as the undersurface layer, if desired.

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Patent Owner(s)

Patent OwnerAddress
BERGQUIST COMPANY THE5300 EDINA INDUSTRIAL BLVD MINNEAPOLIS MN 55439

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bergerson, Steven E St. Louis Park, MN 4 186

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