Semiconductor chip package
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United States of America Patent
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Oct 14, 1997
Grant Date -
N/A
app pub date -
May 8, 1995
filing date -
May 8, 1995
priority date (Note) -
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Abstract
A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive leads. The electrode bumps protrude from the encapsulating material for connection to an external circuit.
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