Micromechanical component and process for the fabrication thereof
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United States of America Patent
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Oct 14, 1997
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N/A
app pub date -
Apr 27, 1995
filing date -
May 29, 1990
priority date (Note) -
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Abstract
A micromechanical component having a carrier and a deformable element of a flat design disposed parallel to a surface of the carrier, with the deformable element being provided with a mechano-electric signal converter. The carrier and the deformable element are fabricated in one piece out of a semiconductor substrate and are electrically insulated from one another, with the insulation being obtained by a buried layer produced by ion implantation thereby providing a micromechanical component which is suitable for joint integration with electric circuits in CMOS technology.
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