Protein-based semiconductor integrated circuit
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United States of America Patent
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Sep 23, 1997
Grant Date -
N/A
app pub date -
Oct 17, 1995
filing date -
Oct 20, 1994
priority date (Note) -
Expired
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Abstract
A semiconductor integrated circuit comprises a conductive protein electrode, such as cytochrome c, deposited on the surface of an apatite insulating layer such as hydroxyapatite, fluorinated apatite or chlorinated apatite. The apatite insulating layer is thin film coated onto a substrate such that it is substantially C-axis (002) oriented, which allows the integrated circuit to be of small size while minimizing undesired electron transfer between electrodes because the conductive protein electrode adopts the orientation of the apatite insulating film.
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