Method of fabricating antifuses in an integrated circuit device and resulting structure
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United States of America Patent
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Sep 23, 1997
Grant Date -
N/A
app pub date -
Jun 6, 1995
filing date -
Mar 20, 1991
priority date (Note) -
Expired
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Abstract
Various improvements in the fabrication of an antifuse having silicon-amorphous silicon-metal layer structure are presented. Included are improved deposition techniques for the amorphous silicon layer. The improvements include steps for the fabrication of such an antifuse without the use of platinum and the resulting antifuse and contact structures.
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