Wire plating
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United States of America Patent
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-
Sep 16, 1997
Grant Date -
N/A
app pub date -
Oct 31, 1995
filing date -
May 8, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a method of continuously coating a conductive substrate such as brass wire to produce a desired cross-sectional size of coated material, the wire is drawn through a first die to produce an oversize wire, electroplate in a bath, and then drawn through a final die to reduce its area to the desired size and produce a controlled surface finish. The wire may be cleaned in an acid bath and rinsed in a rinsing bath prior to the electroplating bath. A further rinsing bath and dryer may be interposed upstream of the final die.
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