Thermally stabilized dewar assembly, and its preparation
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United States of America Patent
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Sep 2, 1997
Grant Date -
N/A
app pub date -
Jun 6, 1995
filing date -
Jun 6, 1995
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Abstract
A dewar assembly has a wall contacting a liquefied gas within the interior of the dewar assembly. The dewar assembly is processed so as to remove the stable gaseous film boiling layer that is normally present between the liquefied gas and the wall. The processing is preferably accomplished by reducing the pressure on the liquefied gas to reduce its temperature and the temperature of the wall, and then returning the pressure over the liquefied gas to ambient to produce a temperature in the liquefied gas which is temporarily greater than that of the wall. The existing gaseous film boiling layer is removed, so that thermal and acoustic variations present in the system due to the presence of the film boiling layer are eliminated, and the liquefied gas attains a more direct contact with the wall.
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