Die and method for applying radial forces to an eccentric workpiece
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United States of America Patent
Stats
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Aug 19, 1997
Grant Date -
N/A
app pub date -
Sep 11, 1995
filing date -
Sep 11, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A die is disclosed for applying radial force to an eccentric workpiece. The die includes a set of faces that are each inclined from an orthogonal relationship with a different radial plane of the workpiece by an offset angle. The die also includes wedges that are positioned on the faces. They each have a jaw surface and a slide surface that are inclined from a parallel relationship with each other by a wedge angle that equals the offset angle of their respective face. The wedges can move over the faces to abut the workpiece along each of a plurality of transverse planes. In each of these planes, their movement can accommodate the workpiece's eccentricity in that plane. In addition, each jaw surface abuts the workpiece in a tangential relationship.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
L-3 COMMUNICATIONS ELECTRON TECHNOLOGIES INC | 3100 W LOMITA BLVD TORRANCE CA 90509 |
International Classification(s)

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- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Brown, II Richard A | Long Beach, CA | 3 | 13 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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