Inorganic constructional board and method of manufacturing the same

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United States of America Patent

PATENT NO 5648154
SERIAL NO

08190105

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An inorganic constructional board for use as wall backing material or the like comprises a middle layer portion (1a) formed mainly of inorganic foamed material with an adequate quantity of fibrous material and binder added thereto, and outer layer portions (1b) placed on both surfaces of the middle layer portion (1a), the outer layer portion being formed mainly of mineral fiber material and inorganic powder material with binder added thereto. The middle layer portion (1a) has a specific gravity of less than 0.4, and the outer layer portions (1b) have a specific gravity of more than 0.7. Therefore, the board is more lightweight than a plaster board and has performance characteristics equivalent to or better than those of the plaster board. The inorganic constructional board (1) is manufactured by forming a wet inorganic mat which constitutes a lower layer portion (1b) of the above mentioned composition, forming a middle layer portion (1a) of the above mentioned composition on the lower layer portion (1b) according to a dry process or wet process, stacking on the middle layer portion (1a) a wet inorganic mat which constitutes an upper layer portion (1b) of the above mentioned composition, then pressing the stacked structure to form an integral laminate and heating to dry the same.

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Patent Owner(s)

Patent OwnerAddress
DAIKEN TRADE & INDUSTRY CO LTD1-1 INAMI-MACHI-INAMI HIGASHITONAMI-GUN TOYAMA-KEN 932-02

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujiwara, Hisashi Okayama, JP 13 146
Koh, Akio Okayama, JP 1 4
Kurosaki, Kiyoshi Okayama, JP 5 106
Masamoto, Shigezoh Okayama, JP 1 4
Shutoh, Keiji Okayama, JP 1 4

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