Electrified object contact component
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United States of America Patent
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Jul 8, 1997
Issued Date -
N/A
app pub date -
Oct 20, 1995
filing date -
Aug 18, 1989
priority date (Note) -
Expired
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Abstract
An electrified object contact material characterized in that an oxide film formed in a high purity oxidizing atmosphere with a thickness from several tens to 100 .ANG. is formed at least in a section directly contacting an electrified object. By using the contact component according to the present invention, the electric potential of a wafer can always be suppressed to 50 V or less, and moreover, contamination of a wafer (especially by a metallic material) can completely be eliminated.
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