Packaging electrical components having a scallop formed in an edge of a circuit board
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United States of America Patent
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-
Jul 1, 1997
Grant Date -
N/A
app pub date -
Nov 10, 1994
filing date -
Nov 10, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A structure includes a baseplate, a circuit board parallel and adjacent to the baseplate, and an electronic component. The circuit board has an edge with a scallop formed in the edge, and the scallop is plated with a conductive material. The electronic component includes a power-dissipating surface and a pad for making electrical connection. The electronic component is mounted with the power-dissipating surface in contact with the baseplate and the pad electrically connected to the conductive material.
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