Expandable resin composition
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United States of America Patent
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Jul 1, 1997
Grant Date -
N/A
app pub date -
Jul 11, 1996
filing date -
Aug 11, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for preparing an expandable resin composition comprising the following steps: (a) admixing, at a temperature in the range of about 120 to about 130 degrees C., the following components: (i) 100 parts by weight of a high pressure, low density homopolymer of ethylene; (ii) about 30 to about 200 parts by weight of a high density polyethylene having a melting point higher than the above mixing temperature; (iii) about 2 to about 50 parts by weight of polypropylene having a DSC melting point of not less than about 140 degrees C.; and (iv) about 0.1 to about 2 parts by weight of a silane coupling agent; and (b) admixing, at a temperature in the range of about 120 to about 130 degrees C., 100 parts by weight of the mixture produced in step (a) with 0.5 to 3 parts by weight of one or more chemical blowing agents having a decomposition temperature higher than the above mixing temperature.
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