Low temperature sealing composition with reduced SiO.sub.2 content but
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United States of America Patent
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Jul 1, 1997
Grant Date -
N/A
app pub date -
Dec 28, 1995
filing date -
Dec 29, 1994
priority date (Note) -
Expired
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Abstract
A low temperature sealing composition comprising PbO--B.sub.2 O.sub.3 --Bi.sub.2 O.sub.3 glass powder with a reduced amount of SiO.sub.2 content but with an addition of GeO.sub.2 so as to realize a lowered sealing temperature such as 400.degree.-310.degree. C. The glass powder consists essentially of 25-85 wt. % of PbO, 1-11.2 wt. % of B.sub.2 O.sub.3, 5.1-70 wt. % of Bi.sub.2 O.sub.3, 0.1-20 wt. % of GeO.sub.2, 0-5 wt. % of SiO.sub.2, 0-10 wt. % of Fe.sub.2 O.sub.3, 0-10 wt. % of CuO, 0-15 wt. % of ZnO, 0-5 wt. % of TiO.sub.2, and 0-9 wt. % of F.sub.2. The glass powder may be used by mixing with 15-55 vol. % of refractory filler powder of at least one element which is selected from the group consisting of lead titanate based ceramic powder, willemite based ceramic powder, cordierite ceramic powder, zircon based ceramic powder, tin oxide solid solution powder, and alumina powder.
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