Novolac type epoxy resin and electronic parts encapsulating resin composition
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United States of America Patent
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Jun 24, 1997
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app pub date -
Jul 24, 1995
filing date -
Apr 28, 1994
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Abstract
This invention relates to a semiconductor encapsulating novolac type epoxy resin with the reduced stress, which is obtained by an addition reaction 1 to 15% of a novolac type epoxy resin of the following formula with a monohydric or dihydric aliphatic alcohol: ##STR1## (wherein R.sub.1 is hydrogen, halogen, alkyl, or aryl; R.sub.2 is selected from the group consisting of hydrogen, alkyl, aryl, or aryl having a substituent which may be glycidylether; and n is an integer not less than 0.)
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