Method for fabricating an electronic device having solder joints
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United States of America Patent
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Jun 24, 1997
Grant Date -
N/A
app pub date -
Jun 2, 1995
filing date -
Jun 30, 1994
priority date (Note) -
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Abstract
Solder joints are formed on external electrodes of a semiconductor device, such as a ball grid array package or flip chip or the like, and higher solder joints are formed on the external electrodes. Each solder joint consists of a plurality of solder bumps, such as a first solder bump and a second solder bump. The process includes the steps of forming a first solder bump on an electrode, the electrode being electrically connected with a terminal of an electronic circuit, applying a first non-conductive material onto the first solder bump so as to encompass with the first non-conductive material the exposed area of the first solder bump except for a top portion of the first solder bump, and forming a second solder bump on the top portion of the first solder bump. A semiconductor device having solder joints higher than the single greatest possible solder ball for a given pitch and pad area is fabricated.
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