Solid printed substrate and electronic circuit package using the same
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United States of America Patent
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Jun 17, 1997
Grant Date -
N/A
app pub date -
Jan 26, 1994
filing date -
Jun 5, 1992
priority date (Note) -
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Abstract
The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil layers stacked thereon is employed placing a thermoplastic polyimide sheet between each copper foil. The metal base substrate with a circuit pattern prepared on each copper foil layer is processed by bending or deep drawing into a box-shaped work which has an opening surface. The opening surface is processed so as to have a substantially equal area with that of the bottom of the substrate and have a collar portion on the periphery thereof. On the collar portion, leads to be used for connection with other wiring substrate are formed by patterning on copper foil layers. Mounting the solid printed substrate on other wiring substrate with the opening surface downwardly oriented, the leads and corresponding circuit patterns of the other wiring substrate are then soldered to finish the mounting of the solid printed substrate on the other wiring substrate. Therefore, by mounting electronic parts on the bottom of the solid printed substrate, an electronic circuit package can be constructed.
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