Sub-ambient temperature electronic package
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United States of America Patent
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Jun 10, 1997
Grant Date -
N/A
app pub date -
Apr 21, 1995
filing date -
Apr 21, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package having an internal cooling device. The integrated circuit package includes a thermoelectric device that operates according to the Peltier cooling effect. The thermoelectric device includes a first plate and a second plate that are thermally connected by a plurality of conducting elements. A package substrate is attached to the first plate such that a chamber is formed. The second plate is disposed within the chamber apart from the package substrate. The second plate is cooled when power is supplied to the thermoelectric device. By disposing an integrated circuit chip on the second plate and evaluating the chamber, the integrated circuit chip may be cooled to a sub-ambient temperature without internal or external condensation.
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