Semiconductor device affixed to an upper and a lower leadframe
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United States of America Patent
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Jun 10, 1997
Issued Date -
N/A
app pub date -
Aug 13, 1996
filing date -
Dec 27, 1991
priority date (Note) -
Expired
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Abstract
A semiconductor device includes a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.
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