Method for reducing metal contamination of silicon wafers during semiconductor manufacturing
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United States of America Patent
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Jun 10, 1997
Grant Date -
N/A
app pub date -
Jun 27, 1994
filing date -
Jun 27, 1994
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Expired
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Abstract
A complex building agent, such as EDTA is added in a predetermined concentration to the 'SC 1' step of a 'PIRANHA-RCA' cleaning sequence for reducing the metal contamination left on the surface of a silicon wafer after completion of this cleaning step.
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