Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits
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United States of America Patent
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-
May 27, 1997
Grant Date -
N/A
app pub date -
Oct 4, 1995
filing date -
Oct 4, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Conductive circuits (copper foil) are provided on both surfaces of a basefilm. A first prepreg is laminated onto both surfaces of the basefilm. A cover lay is provided at an opening portion of the basefilm. The cover lay may extend to a through-hole. The semirigid cover lay, made from polyimide-containing resin material, is placed to cover the opening portion, thermocompressed, and bonded to be laminated onto the surface of the basefilm. A second prepreg having an opening portion whose shape is substantially similar to the opening portion of the first prepreg, is laminated on the first prepreg.
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