Process for manufacturing lead frame for semiconductor package
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United States of America Patent
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May 27, 1997
Grant Date -
N/A
app pub date -
Nov 14, 1995
filing date -
Jul 31, 1995
priority date (Note) -
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Abstract
A process for manufacturing a lead frame having a pad, inner leads, outer leads and dambars, the lead frame being coated with a film on the back surface of the pad, which includes the steps of preparing a lead frame having a pad, inner leads and outer leads; placing a polyamic acid film on the back surface of the pad without using adhesive; and thermally compressing the polyamic acid film by using a heat; generator, to form polyimide film and simultaneously adhere that to the polyimide film the back surface of the pad.
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