Device for pressurizing a plate bundle, especially for a plate heat exchanger

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United States of America Patent

PATENT NO 5630475
SERIAL NO

08431087

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A device for pressurizing a plate bundle which is arranged in a leakproof vessel (2) and comprises a stack of plates which are parallel to one another to form a first circulation circuit for a first fluid under pressure and a second circulation circuit for a second fluid under pressure. The device includes a first conduit (15) for connecting the vessel (2) to the delivery (10) of the first fluid continuously feeding the vessel (2), a second conduit (16) for connecting the vessel (2) to the delivery (12) of the second fluid feeding the vessel (2) in the event of stoppage of the delivery of the first fluid, and controls (20) for feeding of the vessel (2) with the second fluid.

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Patent Owner(s)

Patent OwnerAddress
FRAMATOME1 PLACE JEAN MILLIER TOUR AREVA COURBEVOIE 92400

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Levy, William Paris, FR 24 474
Martin, Emmanuel Le Mesnil St Denis, FR 25 135
Sabin, Dominique Herbeville, FR 8 106

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  • 2 Citation Count
  • G05D Class
  • 5.95 % this patent is cited more than
  • 28 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges11101501135111101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 8081 - 9091 - 10005101520253035404550556065707580859095100105110

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