Resin molding
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United States of America Patent
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May 13, 1997
Issued Date -
N/A
app pub date -
Oct 19, 1993
filing date -
Nov 14, 1989
priority date (Note) -
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Abstract
Disclosed is a resin molding comprising a molding composed of a resin composition comprising 100 parts by weight of a substrate resin comprising 100 to 30% by weight of at least one propylene polymer selected from the group consisting of propylene/ethylene block copolymers having an ethylene content of 3 to 45% by weight and propylene/ethylene random copolymers having an ethylene content of 0.5 to 10% by weight and 0 to 70% by weight of an elastomer, and at least one member selected from the group consisting of (A) 0.01 to 10 parts by weight of a 1,3-diene polymer having at least one terminal hydroxyl group or a hydrogenation product thereof, (B) 0.01 to 40 parts by weight of a copolymer of ethylene with an unsaturated compound containing a carboxyl group (including an acid anhydride group) and (C) 0.01 to 40 parts by weight of a copolymer of ethylene with an unsaturated compound containing a hydroxyl group, with the proviso that if at least two members of components (A), (B) and (C) are used in combination, the total amount does not exceed 40 parts by weight, which preferably has a coating formed directly on the surface of said molded body. One preferred application of this coated resin molding is an automotive part, especially a bumper.
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