Process for inspecting metallic chips fragments in order to eliminate more X-ray absorbent inclusions from them
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United States of America Patent
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May 6, 1997
Grant Date -
N/A
app pub date -
Jun 28, 1994
filing date -
Jun 30, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention is a process for inspecting chips and/or fragments of metal or metal alloy to eliminate from them inclusions of a more X-ray absorbent material than the metal or alloy, wherein a field that delimits a portion of these chips and/or fragments is X-rayed. The process produces an X-ray image which is then converted into an electronic image. This image is analyzed in order to detect the inclusion(s) having features. The features include a background correction of the degree of illumination of each pixel in the field in the absence of chips and/or fragments, a field is covered with the portion of chips and/or fragments, and the electronic image is corrected by subtracting the background correction from the degree of illumination of each of its pixels, and the portion of chips and/or fragments is rejected if this corrected image contains at least one relative pixel corresponding to a chosen condition. Accordingly, the invention may be applied to recycling processes for metal or alloys in the fabrication of dependable parts.
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