Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring
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United States of America Patent
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Apr 15, 1997
Grant Date -
N/A
app pub date -
Nov 29, 1995
filing date -
Nov 29, 1995
priority date (Note) -
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Abstract
Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially uniform using a cathode assembly on which the substrate wafer is mounted. The cathode assembly includes an inner cathode ring electrically connected to the wafer, a thief ring external to the cathode ring and an insulating ring connected between and electrically insulating the cathode and thief rings. The cathode ring and the thief ring are powered by separate power sources.
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