Method for fabricating electronic components incorporating ceramic-metal composites
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United States of America Patent
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Mar 25, 1997
Issued Date -
N/A
app pub date -
Mar 31, 1994
filing date -
Sep 17, 1992
priority date (Note) -
Expired
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Abstract
The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.
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