Apparatus for applying paste
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United States of America Patent
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-
Mar 25, 1997
Grant Date -
N/A
app pub date -
Jul 27, 1994
filing date -
Aug 6, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for applying a paste to a surface of a substrate by holding the substrate on a table and by moving a nozzle relative to the table to form a desired paste pattern on the substrate. The apparatus has a device for measuring the position of a paste ejection orifice of the nozzle, a processing unit for calculating, from a result of the measurement by the measuring device, a displacement of the position of the paste ejection orifice when the nozzle is changed, and a mechanism for positioning the substrate at a desired position with respect to the ejection orifice of the changed nozzle on the basis of a result of the operation of the processsing unit. With this arrangement, even if the position of the ejection orifice of the nozzle is changed when the nozzle is changed, the desired positional relationship between the nozzle and the substrate can be set with improved accuracy, whereby a paste pattern can be drawn accurately.
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