Method and apparatus for waste heat removal from a computer enclosure
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United States of America Patent
Stats
-
Mar 25, 1997
Grant Date -
N/A
app pub date -
Jul 20, 1995
filing date -
Jul 20, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A hot-air chimney for a computer in an enclosure, for the purpose of removing hot air generated by ICs within the enclosure, is fabricated in the shape and form of an expansion card for the computer. The chimney has a base panel in the shape of the expansion card, and an enclosed passage formed on the base panel. The chimney also has an end flange fashioned to simulate an end panel of the expansion card, and the enclosed passage is open to an opening in the end flange. In computers wherein expansion cards are installed parallel to and overlying a motherboard, the hot-air chimney is installed in place of an expansion card adjacent to the motherboard. An opening positioned in the base panel into the enclosed passage, and positioned to overlie a heat-producing IC on the motherboard, conducts heated air from the IC into the enclosed package and then outside the enclosure via the opening in the end flange. The chimney is particularly effective for computers with fan-mounted ICs, such as a CPU with a cooling fan. In some embodiments an EMI-grounding grid is provided over the opening in the end flange of the hot-air chimney.
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