High density fiber optic interconnection enclosure
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United States of America Patent
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-
Mar 18, 1997
Grant Date -
N/A
app pub date -
May 15, 1995
filing date -
May 15, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
An enclosure (10) of the type having a patch panel (56) mountable at an interior location spaced inwardly a selected distance from a front opening (22). A card region (50) behind patch panel (56) receives splice cards (100) or connector cards (200) slidably along pairs of card guides (62, 64). Splice cards (100) include splice connectors (130) along front face (126) for directly splicing first fiber ends (132) to second fiber ends (138) at patch panel (56) in a manner permitting easy unsplicing and resplicing, enabling a high density of optical interconnections. Connector cards (200) provide connectors for mating terminated fiber ends, permitting unmating thereof. A forward, latchable card position is provided facilitating fiber interconnection therewith forwardly of in-service latched positions of adjacent cards. Fiber exits (314) are provided for direct routing of fibers between stacked enclosures (300).
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