Soldering process
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United States of America Patent
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-
Mar 18, 1997
Issued Date -
N/A
app pub date -
Oct 3, 1994
filing date -
Mar 3, 1992
priority date (Note) -
Expired
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Abstract
In a soldering process leads of components on a circuit board are dipped into a solder bath to solder them to the underside of the board. The board is rotated about a horizontal axis as it is lifted away from the bath. This reduces the tendency to form solder bridges between closely spaced leads.
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