Method for encapsulating a semiconductor utilizing an epoxy resin and an onium salt compound
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United States of America Patent
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Mar 11, 1997
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N/A
app pub date -
Sep 7, 1995
filing date -
Sep 8, 1994
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Expired
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Abstract
A method of encapsulating a semiconductor comprising encapsulating a semiconductor in a curable epoxy resin composition comprising a liquid epoxy resin, an inorganic filler, an onium salt compound and an internal releasing agent, and substantially not containing a hardener, and then molding the above composition.
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