Encapsulated semiconductor device package having holes for electrically conductive material
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United States of America Patent
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Mar 4, 1997
Grant Date -
N/A
app pub date -
Mar 9, 1994
filing date -
Mar 17, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a lead and a member for electrically connecting them together. The semiconductor device has one or more first holes respectively extending from one surface of the package to a first side of the lead which is provided inside of the package, and has one or more second holes formed which are aligned with the first holes, respectively, in a manner such that each second hole is extended from the opposing surface of the package to a corresponding location on a second side of the lead and is aligned with a corresponding, opposing first hole, in the package, extending to the first side of the lead. These holes are provided as a plurality of sets of individual pairs of aligned holes respectively extending inwardly, from opposing surfaces of the package, to opposite sides of the corresponding leads. In the device the leads or the leads with resin act as partitions thereby effecting isolation between the first and second holes of each pair aligned holes.
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