Micromechanical component with a dielectric movable structure, and microsystem
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United States of America Patent
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Feb 11, 1997
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N/A
app pub date -
Apr 28, 1995
filing date -
Apr 28, 1994
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Abstract
A micromechanical component includes a fixed micromechanical structure having a pair of capacitor plates being formed of one or more conductive layers, and a movable micromechanical structure being formed of a dielectric layer to be introduced into or removed from an interstice between the plates. A capacitance change is obtained through the resilient or freely movable dielectric, so that the component can be inserted as a proportional or a non-proportional force sensor. A microsystem with an integrated circuit and a micromechanical component with a movable dielectric, as well as a production method for the component and the microsystem, are also provided.
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