Method and apparatus for treating material with a laser
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United States of America Patent
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-
Feb 11, 1997
Grant Date -
N/A
app pub date -
Jul 14, 1994
filing date -
Jul 15, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for reducing unwanted pressure changes generated during treatment of a target material in a liquid-filled space with a laser. A pilot pulse is generated to produce a gas bubble in a region of the liquid-filled space before a processing pulse is directed through the region and onto the target material. An impulse spacing between the pilot pulse and the processing pulse is optimized by detecting an oscillation period of the gas bubble. The pilot pulse and processing pulse may be generated by the same or separate laser sources and directed toward the target material by the same or separate conductors, respectively.
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