System for making plastic blister packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 11, 1997
Issued Date -
N/A
app pub date -
May 31, 1995
filing date -
Apr 17, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Apparatus and method for the packaging of an article in a plastic-card package which includes a flat card having a window aperture cut therein fed to the apparatus, and a flat, thermoformable plastic sheet, cut-to-size larger than the aperture and smaller than the face of the card and positioned to cover the aperture. The perimeter of the sheet is heat tacked by an adhesive to the card at a plurality of points around the perimeter of the aperture, and the thermoformable material is heated to form a blister in the sheet and to heat seal the edges of the formed blister to the card. The blister is filled, and the filled blister is covered with a backing cover sheet, and the card sealed to form a package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully