Ball grid array having reduced mechanical stress
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United States of America Patent
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Jan 28, 1997
Issued Date -
N/A
app pub date -
Jun 15, 1995
filing date -
Jun 15, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package, including semiconductor dies, a ball grid array, and a printed circuit board, is described. Said package has been designed with a view to minimizing its level of internal mechanical stress. This has been achieved through use of two sets of solder joints that have different melting points. The joints with the higher melting point are positioned in the region, on the ball grid array, where it is known that stress will be a maximum in the finished package. The lower melting point joints occupy the remaining positions on the underside of the ball grid array. Ball grid array and printed circuit board are attached to one another by heating at a temperature that is between the aforementioned two melting points.
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