Hermetically sealed memory or PC card unit having a frame, header and covers in bonded engagement
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United States of America Patent
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Jan 21, 1997
Issued Date -
N/A
app pub date -
Oct 5, 1994
filing date -
Nov 10, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved PC Card element, particularly a PC card unit, is presented in which the unit is hermetically sealed. The unit has a metallic frame, a metallic header with glass or ceramic encapsulated through pins, and opposed outer metallic covers, all of the metallic elements being welded together to form a hermetically sealed unit. The metallic frame and header is preferably formed as a single piece, i.e., unitary part, either by casting and machining or by metal injection molding.
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